Micro Dicing Services Specializes in Precision Dicing, Cutting, and Sawing.
With over 30 years of experience, Micro Dicing Services can work with almost any dicing request.
What we do
- Precision Dicing and Sawing
- Dicing Consultation
- Pick and Place Service
- Custom Dicing Blades
- Production and R&D Services
- Quick Turnaround Services
Capabilities
- Dicing accuracy within a tolerance of +/- 2 microns
- Dicing width/kerf of less than 19 microns
- Dicing depth of 3.8 millimeters
- Creation of silicon posts, needles, and tips less than 100um wide
- Partial dicing grooves with "V" or "U" shapes
- Dicing of "Tubes" and "Coils"
- Creation of custom blades for special tolerance requirements
- Mechanical dicing with low water exposure process
What we work with
- IC - Silicon, Gallium Arsenide, MEMS, LED
- Glass & Ceramics - Quartz, Pyrex, SiC, TiC, PZT, Alumina
- Crystals - Sapphire, Ruby, YAG, Zirconia, Lithium Niobate, GaN, Lithium Tantalate, Garnet
- Substrates - Solar Cells, Multi-layer Boards, FR4, Plastic, bonded materials
- Metals - Ag, Al, Cu, W, Mo
- Shapes - Tubes, Coils, Cylinders
Our Partners
Contact Us
Micro Dicing Services
780 Montague Expressway, Suite 303, San Jose, California, 95131
Email - info@microdicingtechnology.com Phone - (408) 321-8840
Hours
Mon | 07:30 am – 05:00 pm | |
Tue | 07:30 am – 05:00 pm | |
Wed | 07:30 am – 05:00 pm | |
Thu | 07:30 am – 05:00 pm | |
Fri | 07:30 am – 05:00 pm | |
Sat | Closed | |
Sun | Closed |
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