Micro Dicing Services Specializes in Precision Dicing, Cutting, and Sawing.

With over 25 years of experience, Micro Dicing Services is uniquely positioned to handle almost any dicing request.

Micro Dicing Services Specializes in Precision Dicing, Cutting, and Sawing.

With over 25 years of experience, Micro Dicing Services is uniquely positioned to handle almost any dicing request.

What we do

Precision Dicing and Sawing
Dicing Consultation
Pick and Place Service
Custom Dicing Blades
Production and R&D Services
Quick Turnaround Services

Capabilities

Dicing accuracy within a tolerance of +/- 2 microns
Dicing width/kerf of less than 19 microns
Dicing depth of 3.8 millimeters
Creation of silicon posts, needles, and tips less than 100um wide
Partial dicing grooves with "V" or "U" shapes
Dicing of "Tubes" and "Coils"
Creation of custom blades for special tolerance requirements
Mechanical dicing with low water exposure process

What we work with

IC - Silicon, Gallium Arsenide, MEMS, LED
Glass & Ceramics - Quartz, Pyrex, SiC, TiC, PZT, Alumina
Crystals - Sapphire, Ruby, YAG, Zirconia, Lithium Niobate, GaN, Lithium Tantalate, Garnet
Substrates - Solar Cells, Multi-layer Boards, FR4, Plastic, bonded materials
Metals - Ag, Al, Cu, W, Mo
Shapes - Tubes, Coils, Cylinders

Contact Us

Micro Dicing Services

780 Montague Expressway, Suite 303, San Jose, California, 95131

Email - info@microdicingtechnology.com Phone - (408) 321-8840

Hours

Mon	07:30 am – 05:00 pm
Tue	07:30 am – 05:00 pm
Wed	07:30 am – 05:00 pm
Thu	07:30 am – 05:00 pm
Fri	07:30 am – 05:00 pm
Sat	Closed
Sun	Closed